Chapter 04
The Blackwell GPU
A single Blackwell package is already at the limit of what a lithography machine can print in one exposure — twice over. Understanding why the die is doubled, and why the number format keeps shrinking, explains most of what the rack is for.
Two dies, one GPU
Chips are printed by projecting a pattern onto silicon, and there is a hard limit to how large a single pattern can be — the "reticle limit". Blackwell hit it. Rather than accept a smaller chip, NVIDIA printed two of the largest possible dies and joined them edge to edge with a link so fast that software cannot tell them apart.
The result behaves as one GPU with 208 billionTransistors per Blackwell GPU 104 B per die, two dies per package. NVIDIA transistors and 192 GBHBM3e per Blackwell GPU 180 GB usable after ECC. NVIDIA of very fast memory attached. You do not schedule work onto "die 0" or "die 1"; you just see one device.
The two dies are TSMC TSMC 4NPProcess node NVIDIA , 208 billionTransistors per Blackwell GPU 104 B per die, two dies per package. NVIDIA in total, joined by NV-HBI at 10 TB/sNV-HBI die-to-die link Makes the two reticle-limited dies present as one cache-coherent GPU. NVIDIA . That bandwidth is the whole trick: it is high enough, and low enough latency, that the pair present as a single cache-coherent device to CUDA. There is no NUMA domain to schedule around, no explicit die affinity, no partitioning of the L2 — 126 MBL2 cache per GPU NVIDIA of it is shared.NVIDIA
Attached is 192 GBHBM3e per Blackwell GPU 180 GB usable after ECC. NVIDIA of HBM3e at 8 TB/sMemory bandwidth per GPU NVIDIA , of which 180 GB is usable after ECC. Hold that bandwidth number next to the FP4 figure of ~20 PFLOPSPeak FP4 per GPU Sparse. NVIDIA and the tension in the design is immediately visible: about 20,000 TFLOPs against 8 TB/s is an arithmetic intensity requirement of roughly 2,500 FLOPs per byte before the tensor cores are the limit. Very few real kernels are anywhere near that.
Two consequences worth being precise about.
The NV-HBI link is a bandwidth solution to a reticle problem, not a latency-free one. Coherence across the die boundary is maintained in hardware, but a cache line sourced from the far die still costs more than a local one; kernels with pathological cross-die access patterns will see it. In practice the scheduler's locality heuristics absorb this, and it is not exposed as a tunable — which is a deliberate choice to keep the programming model simple, and a real constraint if you were hoping to control it.
The 192 GB / 180 GB distinction accounts for a chunk of the disagreement over the rack's pooled HBM total: 72 × 192 GB is 13.82 TB physical, 72 × 180 GB is 12.96 TB usable, and published figures land anywhere in between depending on which the source meant and how it rounded. The site shows ~13.5 TBPooled HBM3e per rackSources disagree: 13.4 – 13.8 TB Sources differ on rounding, on physical versus usable-after-ECC capacity, and on SKU. NVIDIA’s 192 GB per GPU gives 13.82 TB physical and 12.96 TB after ECC; Supermicro’s datasheet quotes up to 372 GB per Superchip — 186 GB per GPU — which is where the 13.4 TB figure comes from. NVIDIA · Supermicro · SemiAnalysis with the range attached rather than picking one.
What shrinking the number format buys
Halving the bits per value does two things at once, and the second matters more than the first: it doubles arithmetic throughput, and it halves the bytes each parameter occupies in memory and on every wire it crosses.
This figure is interactive and needs JavaScript. The prose around it states every number it shows.
The capacity column is the one that changes deployment decisions. A trillion-parameter model at BF16 needs 2 TB of weights and does not fit in a single rack's HBM alongside activations and KV cache. The same model at FP4 needs 500 GB and leaves room to work in. NVFP4 — NVIDIA's block-scaled 4-bit format, which attaches a shared scale factor to small groups of values — exists to make that trade survivable numerically.
It is not free, and the honest framing is that FP4 is a quantisation decision with an accuracy budget, not a free doubling. NVIDIA's own MLPerf submissions are the evidence that the budget can be met on real models: up to 3.2×Blackwell NVFP4 training speedup vs Hopper FP8 MLPerf Training v5.1, Llama 3.1 405B, at the same GPU count. NVIDIA Technical Blog on Llama 3.1 405B training at equal GPU count.NVIDIA Technical Blog
Per-GPU figures
| Transistors per Blackwell GPU | 208 billion | 104 B per die, two dies per package. |
|---|---|---|
| Process node | TSMC 4NP | |
| NV-HBI die-to-die link | 10 TB/s | Makes the two reticle-limited dies present as one cache-coherent GPU. |
| HBM3e per Blackwell GPU | 192 GB | 180 GB usable after ECC. |
| Memory bandwidth per GPU | 8 TB/s | |
| L2 cache per GPU | 126 MB | |
| Peak FP4 per GPU | ~20 PFLOPS | Sparse. |
| NVLink 5 bandwidth per GPU | 1.8 TB/s | Bidirectional: 18 links × 100 GB/s. About 14× PCIe Gen5. |
| Power per GPU | ~1,200 W | The commonly cited per-GPU board power for Blackwell in GB200. Rack power divided by 72 lands higher because the figure excludes the CPUs, NVSwitch trays, NICs and conversion losses. |
Why arithmetic intensity, not FLOPS, is the number to carry around
Divide peak throughput by peak memory bandwidth and you get the FLOPs-per-byte a kernel must achieve before the tensor cores become the constraint. For Blackwell at FP4 that ridge point sits in the low thousands. Dense matrix multiply with large enough tiles clears it. Decode — one token at a time, re-reading every weight — does not come close: it is memory-bound by construction, at any batch size that fits.
This is why the rack is built around bandwidth rather than around FLOPS, and why the next two chapters are about interconnect rather than about compute. The roofline plot makes the same point graphically.